DatapointLabs launches expansion into new 
              facility
              
               Mechanical, rheological, and thermal 
              analysis laboratories in the new facility (clockwise from top)
 
              Mechanical, rheological, and thermal 
              analysis laboratories in the new facility (clockwise from top) 
              
              ITHACA, NY: Aug. 27, 2001- DatapointLabs launched an expansion into 
              a new facility to accommodate its growing line of test instruments. 
              The new facility is composed of four laboratories. The mechanical 
              test lab is a new, climate controlled area housing the universal 
              testing machine, impact testing machines, fatigue and creep machines. 
              A new rheological test laboratory contains the DMA and capillary 
              rheometers as well as the thermal conductivity and HDT testers. 
              The separate thermal analysis laboratory houses a complete Perkin 
              Elmer suite of differential scanning calorimeter, dynamic mechanical 
              analyzer, thermo-mechanical analyzer, thermo-gravimetric analyzer, 
              along with the Karl Fischer moisture analysis equipment. There is 
              a new machining facility for preparation of test specimens. The 
              PVT test laboratory remains unchanged and separate from the other 
              labs.
              
              "Our new facility is 50% larger than our previous space, giving 
              us room for expansion. And the new labs are attractive, welloganized, 
              and efficient," says Twylene Bethard, Lab Manager. 
              
              
No-Flow Temperature in Mold Analysis 
              
              
              The no-flow temperature was first pro posed by Moldflow as a means 
              to define the temperature where plastic stops flowing in the mold. 
              This is an important criterion in mold analysis that defines the 
              location in a mold where the material is solid and unable to flow. 
              Its proper definition is crucial to determination of flow fronts, 
              pressure predictions and shear rates. In subsequent implementations 
              of mold analysis codes, the use of the no-flow temperature was extended 
              still further as a means to determine whether residual stresses 
              would accumulate or dissipate at a particular node, the precursor 
              calculation to the estimation of shrinkage and warpage.
              
              
Analysis
              
              The no-flow temperature is based on a simple measure: molten plastic 
              is cooled at a relatively slow cooling rate in a capillary rheometer 
              under a constant load. The temperature at which flow ceases is the 
              no-flow temperature. The technique yields comparable results to 
              differential scanning calorimetry (DSC) for semi-crystalline materials 
              (eg. PE, PP, PPS) which undergo a kinetic 'crystallization' transition, 
              provided that the DSC tests are performed at slow cooling rates. 
              At the high cooling rates typical to those seen in injection molding, 
              the transitions observed by DSC occur at significantly lower temperatures 
              because of super-cooling effects.
              
              In the case of amorphous materials such as PS and PC, the no-flow 
              temperature is always higher than the typical DSC transition, the 
              glass transition temperature. Further, it has been observed for 
              amorphous materials that the 'solidified' material can start flowing 
              once again if the load is increased. Amorphous transitions do not 
              depend on cooling rate because the glass transition is not kinetic 
              but thermodynamic in nature.
              
              Failure to account for these anomalies has resulted in significant 
              doubt being cast upon the no-flow temperature and the technique 
              has been the subject of widespread criticism as being subjective 
              and, at best, suited for comparative purposes only. While it is 
              true that there could be better ways to measure this transition, 
              importance of measuring a solidification transition correctly cannot 
              be understated. Good simulations require a precise solidification 
              transition.
              
              Several means have been proposed to replace the no-flow temperature. 
              C-MOLD's transition temperature is based solely on DSC, assigning 
              the transition using measures taken from ASTM standards. While it 
              is easy to measure and presents advantages, the DSC transition temperature 
              suffers from a few drawbacks. Chief among these is the assumption 
              that the thermal transition observed by the DSC correlates to the 
              rheological change that results in the cessation of flow in the 
              mold. It can be seen from Figure 1 that this assumption holds well 
              for semi-crystalline materials where the transition is rapid once 
              crystallization commences.
              
              
 Figure 1. Parallel plate rheology data 
              for semi-crystalline polypropylene
              Figure 1. Parallel plate rheology data 
              for semi-crystalline polypropylene 
              
              In the above experiment, we performed rheological measurements using 
              a parallel plate rheometer, observing the variation of the two components 
              of the modulus (G? and G?) with temperature as the sample cooled. 
              In the melt processing region, viscous effects predominate and the 
              G? is higher than the elastic component G?. As we lower the temperature, 
              elastic effects become more important and the melt becomes visco-elastic. 
              Here the elastic component G? is higher than the viscous component 
              G?, though both moduli are low enough that flow is possible. Upon 
              solidification, both moduli increase dramatically, indicating that 
              further flow is not possible. This dramatic increase in modulus 
              represents the solidification transition. While the transitions 
              agree for both techniques, the rheological data is better in that 
              it pinpoints the degree of crystallinity at which solidification 
              occurs, rather than assuming that it occurs at onset of the transition.
              
              With amorphous materials, the transition is more gradual (Figure 
              2) and the no-flow and DSC transition temperature do not match. 
              Curiously, a G?-G? crossover is observed to occur at a higher temperature 
              than Tg, apparently correlating with the no-flow temperature.
              
              
 Figure 2. Parallel plate rheology data 
              for amorphous polystyrene
 
              Figure 2. Parallel plate rheology data 
              for amorphous polystyrene 
              
              Other known problems with the determination of the solidification 
              transition exist, particularly in the case of immiscible blends. 
              DSC analysis shows every transition that occurs but has no means 
              of telling us which transition is significant. For example, a PCPBT 
              blend may show DSC transitions at 220°C for PBT and 140°C 
              for PC. However, blends with small quantities of PBT continue to 
              flow below 220°C, albeit at a higher viscosity. Hence, the DSC 
              based transition temperature has no means to tell us whether we 
              should choose 220°C or 140°C. A no-flow temperature, on 
              the other hand, would be able to distinguish the relevant transition.
              
              
Solutions
              
              The parallel plate rheometer presents the means to accurately quantify 
              the solidification transition for all materials. It yields the temperature 
              sensitivity of viscosity at low temperatures, which increases model 
              accuracy. For amorphous materials, if the current noflow temperature 
              is indeed of importance for simulation, the G?-G? crossover, measured 
              by
              the parallel plate rheometer, provides a quantified measure of the 
              solidification transition and sets a better stage for the correct 
              accumulation of residual stresses in the part, as the plastic moves 
              from the melt to the solid state. Further, the melt is in a state 
              of oscillatory deformation rather than the quiescent state seen 
              in the capillary rheometer. For blends, the parallel plate rheometer 
              will determine the significant transition. Further, it will yield 
              valuable information about the
              change in viscosity with temperature across the transitions. The 
              DSC can be used for semi-crystalline materials. It remains a valuable 
              tool for shifting transitions, to account for effects of high cooling 
              rate.
              
              
Conclusion
              
              A solidification transition is vital to good simulations. It governs 
              the change over from melt to solid state. Techniques exist today 
              to provide robust measurements of the no-flow temperature. Proper 
              implementation of these techniques will enhance the accuracy of 
              molding simulations.
              
              
SIMCON joins TAP
              
              DatapointLabs announces the participation of SIMCON in its TestPaks
® 
              Alliance Program (TAP). CADMOULD is an injection molding simulation 
              program produced by SIMCON, a German software company with an international 
              client base in Europe, USA and Asia. TestPaks for CADMOULD are now 
              available at www.datapointlabs.com. CADMOULD users can now obtain 
              material characterizations for basic filling and post filling simulations. 
              DatapointLabs will provide support for warpage simulations on a 
              case-by-case basis.
              
              
National Research Council, Canada CAE codes 
              to be supported 
              
              Following an agreement with the NRC, the National Research Council 
              of Canada, DatapointLabs is developing TestPaks
® for users of PlasView, 
              BlowView and FormView.
              
              TestPaks
® for PlasView will permit users to obtain input material 
              properties for filling, post-filling and warpage injection molding 
              simulations using PlasView. BlowView and FormView, blow molding 
              and thermoforming simulation codes, require visco-elastic material 
              models. TestPaks
® for these programs will provide the necessary material 
              characterizations to permit the simulation of these processes.
              
              
Simulation for twin screw extrusion supported 
              
              
              TestPaks
® are now available for TXS, a simulation program for fully 
              intermeshing co-rotating twin screw extruders. According to software 
              vendor Polytec, TXS can simulate a range of compounding operations, 
              and supports a variety of screw elements.
              
              Two Testpaks
® have been developed by DatapointLabs. One, recommended 
              for amorphous polymers which are rubbery at ambient temperature, 
              contains all the properties required for simulations using the 'Melt 
              Only' option. The General TestPak is able to handle the simulations 
              for most other materials.
              
              Additional details for these Testpaks
®, including specific tests 
              performed, are available at www.datapointlabs.com. 
              
              
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